Join us in Trondheim this September for the Nordic Chip Collaboration Meetup, a side event of the Trondheim Tech Festival, where industry and academia come together to shape the future of semiconductors in the Nordic countries.
Over two days (29–30 September), we will bring together key players from across the Nordics to share insights, collaborate, and explore new opportunities in chips, design, and advanced technologies. Building on the success of our previous events in Helsinki (2024) and Lund (2025), this gathering will unite stakeholders from across the Nordic and European chip ecosystem to strengthen partnerships and foster collaboration.
Agenda 29 September
9:00 - 9:30: Registration & Coffee
9:30 - 9:45: Opening Session
- Welcome address: Steinar Brede, Nordic Chip Collaboration/Innovation Norway & Joonas Leppänen, Nordic Innovation
- Welcome from Trondheim: Lisa Marie Dickson, Senior Advisor International Business Relations, City of Trondheim
9:45 - 10:15: Keynote: The EU Chips Act 2.0: an ecosystem approach to technological sovereignty
- Zeno Tornasi, European Commission
10:15 - 11:30: Plenary session - Keynotes and Panel: Chips Design as a Nordic Stronghold
The Nordics have built a strong and globally competitive position in chip design across wireless, sensing, embedded systems, and advanced ASICs. This session highlights key strengths, success factors, and opportunities to further scale in a global landscape.
Confirmed speakers:
- Vegard Wollan, Nordic Semiconductor – Chief Executive Officer / President
- Veijo Kontas, Wstcon Oy / FiCCC / Tamllink – CEO & Senior Advisor
- Fredrik Tillman, Ericsson, Head of Integrated Radio Systems
- Moderator: Toni Mattila, Business Finland
11:30 - 12:30: Lunch break
12:30 - 14:00: Early afternoon · Choose one of two parallel sessions
Session A: Behind the EU Chips Design Platform (EuroCDP)
EuroCDP aims to strengthen Europe's semiconductor design capacity by connecting design tools, IP, training, funding and access to fabrication and testing. The session explores platform vision, expected impact and how industry and research can engage.
Confirmed speakers:
- Romano Hoofman, Strategic Development Director, imec
- Vermund Bakken, CTO and Founder, Onio
- Elina Mielityinen, Chip Design Platform, FiCCC
- Moderator: Pier Paolo Aurino, Technology & Growth lead, Chalmers Industriteknik, SCCC
- Session B: Chip Packaging & heterogeneous integration
Advanced packaging and heterogeneous integration enable higher system performance through chiplets, 3D integration and advanced ASIC packaging. This session explores technology trends and opportunities for the Nordics. Confirmed speakers:
- Dr. Teresa Orellana Pérez, Manager Business Development, APECS Pilot Line, Research Fab Microelectronics Germany (FMD)
- Alan Moghal, Advanced Packaging Area Manager, Intel Ireland
- Jari Arstila, Director, Murata Electronics
- Moderator: Feng-I Tai, Semiconductor Program Lead, Materials & Industrials, Business Sweden
14:00 - 14:30: Coffee break
14:30 - 16:00: Late afternoon · Choose one of two parallel sessions
Session C: AI Workflows for Chip Design
As semiconductor design becomes more complex, AI is starting to support architecture, design, verification and optimization. This session explores practical examples of AI-enabled workflows and what they mean for future competitiveness.
Confirmed speakers:
- Kirill Bykov, Staff Engineer, Arm
- Jo Uthus, Executive VP, Nordic Semiconductor
- Frode Sundal, Associate Director, Microchip
- David Conochie. IC Optimize - CSO
- Isto Hyyrylainen, Account Technical Executive, Cadence
- Moderator: Steinar Brede, Innovation Norway - Special Advisor
Session D: Talent Development & Attraction
Access to skilled talent is critical for strengthening the semiconductor ecosystem in an increasingly competitive global market. This session looks at how the Nordics can build and attract talent across the full value chain, from education and reskilling to international recruitment.
Confirmed speakers:
- Joachim Rodrigues, Lund University/ FAU (Friedrich-Alexander-Universität)/ BCDC
- Carsten Wulff, NTNU / Nordic Semiconductor
- Pierre-Alexandre Bou-Ach, Technical Director, Arm
- Sofia Persson Björk, Manager Sales and Operation, Qamcom
- Moderator: Sayani Majumdar, Tampere University - Associate Professor, Electrical Engineering
16:15 - 16:30: Closing session
Day 2 - Wednesday 30 September
Day 2 of the Nordic Chip Collaboration event will offer participants the opportunity to experience the ecosystem first-hand through industry visits to Nordic Semiconductor, Arm Norway and Microchip. Participants will gain unique insights into leading Nordic companies and research environments, exploring how innovation in semiconductors is applied in practice and creating value across the semiconductor value chain.
Bus leaving from Radisson Blu Royal Garden Hotel (Kjøpmannsgata 73) at 09:00
- Nordic Semiconductor
- Arm Norway
- Microchip
Bus return to Radisson Blu Royal Garden Hotel at approximately 14:30
Background
Nordic Chip Collaboration is supported under the program 'Nordic Growth and Capital Attraction. The partners are Innovation Norway, Business Sweden and Business Finland.
