Join us in Trondheim this September for the Nordic Chip Collaboration Meetup, a side event of the Trondheim Tech Festival, where industry and academia come together to shape the future of semiconductors in the Nordic countries.
Over two days (29–30 September), we will bring together key players from across the Nordics to share insights, collaborate, and explore new opportunities in chips, design, and advanced technologies. Building on the success of our previous events in Helsinki (2024) and Lund (2025), this gathering will unite stakeholders from across the Nordic and European chip ecosystem to strengthen partnerships and foster collaboration.
Preliminary agenda 29 September (Will be updated):
Plenary session: Chips Design – a Nordic Stronghold (Keynotes)
- The Nordics have built a strong and globally competitive position in chip design across wireless, sensing, embedded systems, and advanced ASICs. This session highlights key strengths, success factors, and opportunities to further scale in a global landscape.
Confirmed speakers:
- Vegard Wollan, Nordic Semiconductor – Chief Executive Officer / President
- Veijo Kontas, Wstcon Oy / FiCCC / Tamllink – CEO & Senior Advisor
- Fredrik Tillman, Ericsson Research – Senior Research Manager
Session: Behind the EU Chips Design Platform (EuroCDP)
- An inside look at Europe’s new chip design platform, bringing together tools, IP, funding, and access to prototyping and fabrication in one place. The session explores how EuroCDP aims to lower barriers, accelerate innovation, and strengthen Europe’s semiconductor ecosystem.
Session: AI Workflows for Chip Design
- AI is rapidly transforming chip development, from architecture and design to verification and optimization. This session explores practical use cases and what these changes mean for innovation and future competitiveness.
Session: Talent Development & Attraction
- Access to skilled talent is critical for strengthening the semiconductor ecosystem in an increasingly competitive global market. This session looks at how the Nordics can build and attract talent across the full value chain, from education and reskilling to international recruitment.
Session: Chip Packaging & heterogeneous integration
- Advanced packaging and heterogeneous integration are becoming key drivers of performance and innovation as scaling at the transistor level slows. This session explores developments such as chiplets and 3D integration, and what they mean for Nordic industry and value chains.
The day will conclude with an optional networking dinner.
Preliminary agenda 30 September:
- Day 2 of the Nordic Chip Collaboration event will offer participants the opportunity to experience the ecosystem first-hand through industry visits in Trondheim. Participants will gain unique insights into leading Nordic companies and research environments, exploring how innovation in semiconductors is applied in practice and creating value across the semiconductor value chain.
Visits to: Nordic Semiconductor, Arm Norway and Microchip
Background
Nordic Chip Collaboration is supported under the program 'Nordic Growth and Capital Attraction. The partners are Innovation Norway, Business Sweden and Business Finland.
